Whether the LED lamp is stable, the quality is good or not, and the heat dissipation of the lamp body itself is important. At present, the heat dissipation of the high-brightness LED lamp on the market usually adopts natural heat dissipation, and the effect is not satisfactory. The heat dissipation is not ideal, and the life of the lamp itself will be affected.
The application of heat dissipating materials in the industry should not only focus on the heat dissipation coefficient, but ignore the thermal resistance value. If you only see a certain heat sink, heat sink, heat sink or thermal film with a good heat dissipation coefficient, you can think that you can conduct high heat out, which may be disappointing. It is expected that the temperature will drop, the LED epitaxial will not be light-degraded due to overheating, the life of the street lamp can be effectively extended, and the acceptance can be smoothly passed, which may not occur.
Etching the tin from the substrate line, coating the LED backlight ink, baking the upper protective film into the oven, leveling the whole board, attaching the thermal conductive film, and then bonding the heat dissipating module with adhesive or lock, in this cumbersome process It can be found that the material with the best thermal conductivity is also defeated by the thermal resistance. The air, the non-closed pores of the joint, the heat-dissipating gasket, the powder formed by the evaporation of the heat-dissipating oil, and the film thickness of the multi-layer thermal conductive film all form a thermal impedance. These multiple levels of thermal resistance can impede the rate of heat conduction, heat conduction is very slow, and even conduction to the surface of the luminaire, resulting in a cumulative increase in heat. The white backlight ink on the surface of the aluminum substrate should not only be reflective, but also can disperse the heat of the lower layer through the backlight of the surface.
Some manufacturers do not observe, replacing the LED-specific backlight ink with a general white text ink, which is equivalent to adding a layer of hard paint to seal the heat. After many failures, manufacturers have accepted new ideas and processes, focusing on the overall cooling program. The aluminum substrate is changed to the special heat-dissipating white backlight ink for LED. If the yellowish backlight ink is specified, the reflectivity will be increased to 91. The soft ceramic heat-dissipating paint is sprayed between the copper foil substrate and the aluminum substrate to reduce the Japanese The amount of the thermal conductive film used increases the breakdown voltage at a very low cost.
To protect the luminaire from the climatic environment, the heat is effectively conducted out, and the effective way to save money is to spray a soft ceramic heat-dissipating paint. Only from the perspective of the overall heat dissipation concept, reducing the thermal resistance interference is the key to the acceptance of LED large lamps. The lamp protection enclosure should be abandoning the traditional plating or baking finish. These two methods will seal the heat back into the fixture.
The basic function of the Solder Preform Feeder is to flatten the solder thin or wire and produce solder plates. The use of the solder plate is to add thickness to some components that requires more solder content. The purpose of the feeder is to lessen the cost by taking out costings on component reels or other solutions that is currently implemented in SMT production process. KDW Solder Preform Feeder can be customized to any SMT Mounter brand and models. Currently, the Solder Preform Feeder is now available and passed machine compatibility test for SMT machine brands such as Juki, Samsung, Fuji, Yamaha, Panasonic, and Siemens.
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