Intelligent laser cutting head improves cutting efficiency

With the development of modern machinery processing industry, the requirements for the quality and precision of cutting have been continuously improved, and the requirements for improving production efficiency, reducing production costs, and having high-efficiency automatic cutting functions are also increasing. As a part of the cutting machine industry, the products we provide will be the most modern and technological. Welcome everyone to discuss cooperation. Details:/
Laser cutting has become a common method for a wide range of material types, specifications, and forms. Its application range is steadily increasing, and all applications require a highly flexible interface between the laser and the workpiece and the machine. .
In order to meet the special needs of end users and take into account the flexibility of laser machines, many models of cutting heads and nozzle bodies have been developed in recent years. Multiple sensors ensure stable and consistent cutting quality even when handling coated surfaces, and the integration of sensors and cutting heads increases process safety and minimizes processing time.
In a three-dimensional application, a continuous rotary linear drive shaft is used and an elongated nozzle body is required. These applications are increasingly sophisticated, so that in the event of a collision of the nozzle electrode or other surface, the sensor control circuit must be able to handle plasma, velocity and failure The interference caused by the signal is compensated. In order to control process parameters to ensure consistent and consistent product quality, microcontrollers are now used for process monitoring and regulation.
A new development of laser cutting sensor technology is the speed sensor. The PS 130 process sensor was originally developed for laser perforation and plans to control the CO2 laser perforation and cutting process with Precitec's Lasermatic or Lasermatic Z focus heads. This sensor system consists of a measuring device, a preamplifier and a sensor to estimate the visible spectrum and infrared spectrum emitted by the laser during the cutting process. This kind of estimation is particularly accurate in the case of stainless steel or thick sheets, because it can be corrected immediately if an error occurs. The use of PS 130 facilitates the reduction of failed or incomplete cutting.
WA Whitney Inc. incorporated the PS 130 into the PlateLASER system. These systems are fully capable of handling thin and thick plates in a production environment. A key element of this process is the ability of individual lens axes of each system to adjust the focus position in real time. The Whitney Smart Laser Controller automatically performs the lens position adjustment described above and virtually any process parameter adjustment. All parameters can be set using Material Parameter Libraries, enabling automatic perforation, auto-induction, auto-steering and speed-sensing cutter processes to be adjusted in real time.
During the initial development phase of the system, no penetration detection method was used because the penetration process was so rapid and stable when using the PlateLASER system to cut 1-1/4" materials, so it is considered that such detection is not necessary. During the process, as long as the focal position of the lens follows the burning point downwards, fine holes can be formed in the material, which minimizes the penetration time and keeps the surrounding materials cool, leaving room for precision cutting. The speed is high without the need for separate nozzles, cutting heads or time-consuming pre-punching operations.
However, in order to make the cutting process reach the limit thickness and/or feed rate and still maintain a stable production level, the system needs to be equipped with monitoring devices. Whitney developed a self-tuning real-time process control option and used the PS 130 perforation sensor as the feedback mechanism, with feedback signals based on the parameter settings of the material parameter library.
During piercing, the puncturing routine is terminated as soon as the signal level indicative of material puncture is reduced.
Multiple signal level triggers are set during the cutting process. Once there is a problem with the cutting process (due to material deformation, difficult to implement programmed geometry, etc.), the trigger signal level will be higher than normal. At this point, the cutting process automatically slows or pauses until the signal returns to normal level. When the signal drops to "Restore Cut Trigger Level", the feed rate quickly returns to normal speed. As long as the PS 130 signal rises again, the process repeats again. If a catastrophic event occurs (irreparable damage to the cutting process), the trigger signal reaches the "accident signal level", causing the cutting process to stop and issue an alert signal.
Self-adjusting process monitors are of great benefit to the end user: materials can be machined faster without constant supervision; the feed rate can be increased with confidence, breaking through the conservative level and allowing the cutting process to continue at a steady production level. Moreover, the Whitney system's rapid piercing time can be reduced by 0.1 to 2.0 s, which can accumulate as a huge production time benefit with multiple piercing cycles.
Problems are prevented so that the cutting process can be automatically restored or manually intervened to avoid scrapping materials and wasting production time, and to avoid damage to the nozzles, lenses or other system components. As with the self-tuning process monitor option, the sensor provides additional performance and reliability guarantees for the thick and thin plate cutting process in addition to the rapid piercing time.
The highly accurate non-contact sensor system is a key element of today's technology. These sensors make use of electro-optical measurement technology to enable reliable application of modern processing methods. The company will focus on the development of optoelectronics and image processing solutions that are ideally suited to the needs of laser material processing and process monitoring through the innovation of optical, electronic and mechanical components to provide a more productive production environment.
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